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Electronics & Photonics (EP) Department

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The Electronics & Photonics (EP) Department exploits the use of High Performance Computing (HPC) resources in the research of advanced computational electromagnetics and computational nanoelectronics.

The E&P Department’s mission is as follows:

  • To advance the frontiers of photonics and plasmonics for active and passive element research
  • To develop novel structures and computational methods for furthering integrated circuit packaging and electromagnetics.
  • To exploit, collaborate, and further advance research breakthroughs with industry and academia in high-performance studies
  • Antenna, RFID and RF devices
  • EMC/EMI
  • Signal/power integrity
  • Electromagnetic design and analysis of IC and electronic packaging
  • Design and analysis of 3D integrated circuits and integration
  • Design and optimization of photovoltaic
  • Silicon photonic devices
  • Bio-photonic sensors
  • Plasmonic devices
The Department consists of three major Capability Groups:

Radio Frequency Engineering (RF)

Lightwave Engineering (LE)

Plasmonics & Nanointegration (PN)



Radio Frequency Engineering

The Radio Frequency Engineering (RF) Capability Group develops novel structures and computational methods for furthering integrated circuits and packaging using advanced computational resources and actively collaborates and advances research breakthroughs with industry and academia in high-performance studies.

Research Directions / Challenges

  • Developing tools for electromagnetic modeling and simulation
  • Developing tools for complex and large Electromagnetic Compatibility (EMC) modelling technology
  • Modeling and simulation for
    • wireless communication devices
    • nanoscale IC & 3-D electronics packaging
    • electro-optical & thermal coupling analysis
    • EMC/EMI
    • Bioelectromagnetics
    • RF Devices

Figure 1: Through-Silicon-Via (TSV) in Ground-Signal-Signal-Ground (GSSG) configuration and its equivalent circuits.


Figure 2: GUI for package solver.


Figure 3: Current and near field distribution for a dipole in a PEC room.


Figure 4: Virtual EMC Lab Environment.


Figure 5: Ray interaction in an aircraft cabin.


Lightwave Engineering

The Lightwave Engineering (LE) Capability Group focuses its efforts in advancing the state-of-the-art of active and passive optical devices and circuits, leveraging on advanced computational platforms and software, both in collaboration with academia and industry.

Research Directions / Challenges

  • Numerical modeling & simulation of silicon-photonic devices for high-speed data communications
  • Developing tools for complex photonic modeling and simulation
  • Exploration of monolithic integration in silicon CMOS-compatible optical technology
  • Green Photonics
  • Solar Cells
Potential Applications:
  • Low power high speed data transmission in storage centers, chip-chip interconnects
  • Data multiplexing and de-multiplexing applications
  • Highly sensitive sensing & diagnostics of a wide range of samples
  • Anti-reflection coating

Figure 6: Electric field distribution of pyramidal antireflection coating.


Figure 7: Optical properties of composite materials


Figure 8: Subwavelength imaging with a Maxwell Garnett composite


Figure 9: Precise Mapping of Electrical Data into Optical Domain (pending Technology Disclosure)


Figure 10: High speed eye diagram simulation of an optical modulator (pending Technology Disclosure)


Plasmonics & Nanointegration

The Plasmonics & Nanointegration (PN) Capability Group studies surface plasmon resonances in nano-scale devices and circuits for communications and sensing applications using state-of-the-art of computing resources and software, with collaborating partners from industry and academia.

Research Directions / Challenges

  • Fundamental study of localized surface plasmon resonance and propagating surface plasmon polaritons in metallic nanostructures
  • Demonstrating localized surface plasmon resonance based sensor technology platforms implemented with nanostructures (e.g. nanoholes, nanoslits, nanoparticles and nanograting) to detect small and large molecules of biomedical, food and environmental interest
  • Manipulating light in a subwavelength scale with state of the art plasmonic devices, including subwavelength waveguides, couplers, modulators, splitters, filters, multiplexers and detectors, for high-bandwidth requirements in data centers, multicore processors and on-chip optical interconnects
  • Exploration nanoscale integrated plasmonics and silicon photonics platform for Tb/s communication bandwidth
Potential Applications:
  • High-speed data transmission: data centers & multi-core processors, on-chip optical interconnects for nanoelectronic circuits
  • Sensing: Plasmonic sensors for biomedical screening & diagnostics, agricultural product or food testing, and environmental monitoring
  • Nanoscopy with focus light: bio-imaging and Nanolithography

Figure 11: (left) Nanoscale THz-speed plasmonic detector by using a nanoantenna and nanocavity; (right) Power flow showing that the optical power from the waveguide is highly concentrated in the active area of the plasmonic detector.

Figure 12: (left top) Schematic of a hybrid dielectric loaded plasmonic waveguide; (left bottom) Ring resonator formed with hybrid dielectric loaded plasmonic waveguides; (right) Electric-field distribution to show the on/off functions of the ring resonator formed with hybrid dielectric loaded plasmonic waveguides.

Figure 13: Schematic of a nanohole-array bio-sensor for detecting small molecules with plasmonics enhanced fluorescence.


Dr. Jason Png
Acting Department Director



This page is last updated at: 16-Jul-2013