Institute of High Performance Computing

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People: Vibrant & Dynamic Culture

People

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Engineering Mechanics (EM)

Dr. GUO Tianfu

Dr. GUO Tianfu


Research Interests:

  • Constitutive modeling of porous polymeric materials
  • Rate-dependent void growth and fracture
  • Thermal and moisture induced failure of IC devices

Qualifications:

  • PhD in Solid Mechanics, Tsinghua University, China, 1992
  • M. Eng in Computational Mechanics, Dalian University of Technology, China, 1989

Published Journals/ Articles:

Journals

    1. Murali P, Guo TF, Zhang YW, Narasimhan R, Li Y, Gao HJ, 2011. Atomic scale fluctuations govern brittle fracture and cavitation behavior in metallic glasses. Phys Rev Lett 107 (21), 215501.
       
    2. Tang S, Guo TF, Cheng L, 2011. Modeling hydrogen attack effect on creep fracture toughness. Int J Solids Struct 48 (20), 2909-2919.
       
    3. Zhang XX, Guo TF, Zhang YW, 2011. Instability analysis of a programmed hydrogel plate under swelling. J Appl Phys 109, 063527.
       
    4. Wong WH, Guo TF, Zhang YW, Cheng L, 2010. Surface instability maps for soft materials. Soft Matter 6, 5743-5750.
       
    5. Zhang XX, Guo TF, Zhang YW, 2010. Formation of gears through buckling multilayered film–hydrogel structures. Thin Solid Films 518, 6048-6051.
       
    6. Wong WH, Guo TF, Zhang YW, Cheng L, 2010. Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysis. Int J Solids Struct 47 (16), 2034-2042.
       
    7. Wong WH, Guo TF, Cheng L, 2010. Void growth and interaction in a soft material. Int J Mod Phys B 24 (1-2), 295-304.
       
    8. Tang S, Guo TF, Cheng L, 2009. Dynamic toughness in elastic nonlinear viscous solids. J Mech Phys Solids 57 (2), 384-400.
       
    9. Cheong WG, Chew HB, Guo TF, Cheng L, 2009. Thermo-mechanical analysis of Plastic Ball Grid Arrays with vapor pressure effects. IEEE T Compon Pack T 32 (1), 12-19.
       
    10. Tang S, Guo TF, Cheng L, 2008. C*-controlled creep crack growth by grain boundary cavitation. Acta Mater 56 (18), 5293-5303.
       
    11. Tang S, Guo TF, Cheng L, 2008. Creep fracture toughness using conventional and cell element approaches. Comp Mater Sci 44 (1), 138-144.
       
    12. Chew HB, Guo TF, Cheng L, 2008. Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages. IEEE T Compon Pack T 31 (2), 277-284.
       
    13. Guo TF, Faleskog J, Shih CF, 2008. Continuum modeling of a porous solid with pressure-sensitive dilatant matrix. J Mech Phys Solids 56 (6), 2188-2212.
       
    14. Tang S, Guo TF, Cheng L, 2008. Mode mixity and nonlinear viscous effects on toughness of interfaces.� Int J Solids Struct 45, 2493-2511.
       
    15. Tang S, Guo TF, Cheng L, 2008. Rate effects on toughness in elastic nonlinear viscous solids. J Mech Phys Solids 56 (3), 974-992.
       
    16. Chew HB, Guo TF, Cheng L, 2007. Pressure-sensitive ductile layers - II. 3D models of extensive damage. Int J Solids Struct 44 (16), 5349-5368.
       
    17. Chew HB, Guo TF, Cheng L, 2007. Pressure-sensitive ductile layers - I. Modeling the growth of extensive damage. Int J Solids Struct 44, 2553-2570.
       
    18. Cheng L, Guo TF, 2007. Void interaction and coalescence in polymeric materials. Int J Solids Struct 44, 1787-1808.
       
    19. Chew HB, Guo TF, Cheng L, 2006. Effects of pressure-sensitivity and plastic dilatancy on void growth and interaction. Int J Solids Struct 43, 6380-6397.
       
    20. Chew HB, Guo TF, Cheng L, 2006. Vapor pressure and voiding effects on thin film damage. Thin Solid Films 504, 325-330.
       
    21. Chew HB, Guo TF, Cheng L, 2005. Vapor pressure and residual stress effects on mixed mode toughness of an adhesive film. Int J Fracture 134 (3), 349-368.
       
    22. Chew HB, Guo TF, Cheng L, 2005. Vapor pressure and residual stress effects on failure of an adhesive film. Int J Solids Struct 42, 4795-481.
       
    23. Chong CW, Guo TF, Cheng L, 2004. Vapor pressure assisted crack growth at interfaces under mixed loading. Comp Mater Sci 30, 425-432.
       
    24. Chew HB, Guo TF, Cheng L, 2004. Vapor pressure and residual stress effects on the toughness of polymeric adhesive joints. Eng Fract Mech 71 (16-17), 2435-2448.
       
    25. Cheng L, Guo TF, 2003. Vapor pressure assisted void growth and cracking of polymeric films and interfaces. Interface Sci 11, 277-290.
       
    26. Guo TF, Cheng L, 2003. Vapor pressure and void size effects on failure of a constrained ductile film. J Mech Phys Solids 51 (6), 993-1014.
       
    27. Guo TF, Cheng L, 2002. Modeling vapor pressure effects on void rupture and crack growth resistance. Acta Mater 50 (13), 3487-3500.
       
    28. Chong CW, Guo TF, Cheng L, 2002. Popcorn failure and unstable void growth in plastic electronic packages. Key Eng Mater 227, 61-66.
       
    29. Jiang H, Huang Y, Guo TF, Hwang KC, 2002. An alternative decomposition of the strain gradient tensor. J Appl Mech–T ASME 69 (2), 139-141.
       
    30. Guo TF, Cheng L, 2001. Thermal and vapor pressure effects on cavitation and void growth. J Mater Sci 36 (24), 5871-5879.
       
    31. Yin LZ, Yang W, Guo TF, 2000. Tunnel reinforcement via topology optimization. Int J Numer Anal Met Geomech 24 (2), 201-213.
       
    32. Qiu XM, Guo TF, Hwang KC, 2000. FEM solutions for plane stress mode-I and mode-II cracks in strain gradient plasticity. Science in China A43 (9), 969-979 (English edition); A30 (8), 760-768 (Chinese edition).
       
    33. Qiu XM, Guo TF, Hwang KC, 1999. Crack tip fields in elastic-plastic media with strain gradient effects. Abstract of Chinese Academic Periodicals (Zhongguo Xueshu Qikan Wenzhai) 5 (1), 91-93 (in Chinese).
       
    34. Huang Y, Chen JY, Guo TF, Zhang L, Hwang KC, 1999. Analytic and numerical studies on mode I and mode II fracture in elastic-plastic materials with strain gradient effects. Int J Fracture 100, 1-27.
       
    35. Hwang KC, Guo TF, Huang Y, Chen JY, 1998. Fracture in strain gradient elasticity. Met Mater-Int 4 (4), 593-600.
       
    36. Huang Y, Zhang L, Guo TF, Hwang KC, 1997. Mixed mode near-tip fields for cracks in materials with strain-gradient effects. J Mech Phys Solids 45 (3), 439-465.
       
    37. Guo TF, Sun QP, Zhang X, 1997. The role of autocatalysis and transformation shear in crack tip zone shape and toughening of zirconia ceramics. Int J Solids Struct 34 (31-32), 413-436.
       
    38. Sun QP, Guo TF, Li XJ, Zhang X, 1996. Effect of dual-scale microstructure on the toughening of laminar zirconia composites. Int J Fracture 78 (3-4), 315-330.
       
    39. Zhu T, Yang W, Guo TF, 1996. Quasi-cleavage processes driven by dislocation pileups. Acta Mater 44 (8), 3049-3058.
       
    40. Guo TF, Hwang KC, Zhang X, 1996. Transformation toughening of a ceramic in stable crack growth under plane stress conditions. Acta Mech Solida Sinica 9 (4), 330-336 (English ed..
       
    41. Guo TF, Yang W, 1995. Brittle-damage analysis of cracks under conditions of plane strain tensile loading. Acta Mech Solida Sinica 8 (1), 15-23 (English ed.); 16 (2), 132-139 (Chinese ed.).
       
    42. Yang W, Tan HL, Guo TF, 1994. Evolution of crack tip process zone. Model Simul Mater Sci Eng 2 (3a), 767-782.
       
    43. Guo TF, Yang W, 1993. Crack tip profiles generated by anisotropic damage. Int J Damage Mech 2 (4), 364-384.
       
    44. Yang W, Guo TF, Fu ZL, 1993. Crack tip superblunting: Experiment, theory and numerical simulation. Acta Mech Sinica 9 (2), 131-141 (English ed.); 25 (4), 468-478 (Chinese ed..
       
    45. Sui YK, Wang XC, Guo TF, Xu D, 1992. Unified approach to optimum design of structures containing beam with multi-design parameters by using primal algorithm of geometric programming. Comp Struct Mech Appl 9 (4), 422-429 (in Chinese).
       
    46. Sui YK, Guo TF, 1990. The analytical solution based on the concept of finite element methods. Appl Math Mech 11 (4), 321-331 (English ed.); 301-310 (Chinese ed.).

Conferences

    1. Hwang KC, Jiang W, Guo TF. Near-tip fields around cracks growing steadily in creeping materials with damage. In: Fracture of Engineering Materials and Structures (Teoh C.H. and Lee, K.H. eds.), Proc. of ICF/FEFG Symposium, Singapore. Elsevier Pub., 1991. pp. 599-605. 
    2. Guo TF, Hwang KC, Zhang XT. Finite element solution of cracked body made of damaged material. In: Comp. Methods in Engng. -- Advance and Applications (A.O. Tay and K.Y. Lam eds.) Vol.2, pp.1087-1092. World Scientific Press (1992).
    3. Yang W, Guo TF, Fu ZL, Cheng L, Hwang KC. Toughening mechanics of Polypropylene blends modified by elastomers. Proc. of the National Symposium on DEFORMATION, DAMAGE AND FRACTURE OF POLYMERS, Ningbo, pp.253-264, 1992 (in Chinese).
       
    4. Hwang KC, Guo TF. Some recent results on crack tip analysis. In: Advances in FRACTURE RESISTANCE IN MATERIALS (ICF8, 1993), Vol.1, pp.273-280, 1996. Tata McGraw-Hill Publishing Company Limited.
       
    5. Guo TF, Hwang KC. Softening instability in transformation plasticity of zirconia-toughened ceramics. In: Localised Damage IV Computer-Aided Assessment and Control (eds. H. Nisitani et al.), Computational Mechanics Publications, pp.67-82, 1996.
       
    6. Huang Y, Zhang L, Guo TF, Hwang KC. Near-tip fields for cracks in materials with strain gradient effects. In: IUTAM Symposium on Nonlinear Analysis of Fracture (J.R. Willis ed.), pp.231-243, 1997, Kluwer Academic Publisher. Printed in the Netherlands.
       
    7. Huang Y, Zhang L, Guo TF, Hwang KC. Fracture of materials with strain gradient effects. In: Advances in Fracture Research ICF9, Sydney, Australian, 1997, Vol.5, pp.2275-2286, eds. B.L. Karihaloo, Y.-W. Mai, M.I. Ripley, and R.O. Ritchie, Pergamon.
    8. Huang Y, Hwang KC, Guo TF. Fracture of materials at the microscale. In: Mechanical Problems of Advanced Engineering Materials (eds. Senoo M et al.), pp. 3-12, 1997, Mie University Press, Tsu, Japan (IMMM"97).
       
    9. Guo TF, Cheng L. A micromechanics model of popcorn failure in electronic packages. Proceedings of The International Workshop on Advances in Materials Science and Technology (eds. J. Lye et al.), p.102. 3-6 April 2000, Institute of Materials Research & Engineering (IMRE), Singapore (ISBN 981-04-2419-1).
       
    10. Chew HB, Guo TF, Cheng L. Modelling interface delamination in plastic IC packages. Proceedings of APACK 2001 Conference on Advances in Packaging (eds. Stephen Wong, John HL Pang, Z.P. Wang, and Albert Lu), 5-7 Dec 2001, Singapore, pp. 381-388. (ISBN 981-04-4638-1).
    11. Chew HB, Guo TF, Cheng L. A mechanism-based approach for interface toughness of ductile layer joining elastic solids", JSME/ASME International Conference on Materials and Processing 2002, October 15-18, Hawaii, Vol. 1, pp. 570-575.
    12. Chong CW, Guo TF, Cheng L. Computational study of vapor pressure assisted crack growth at polymer/ceramic interfaces. Recent Advances in Computational Science & Engineering: Proceedings of the International Conference on Scientific and Engineering Computation (IC-SEC) 2002: 3-5 December 2002, Singapore / editors, H.P. Lee & K. Kumar. pp. 539-542 (2002), London: Imperial College Press, 2002. (ISBN 1-86094-345-4).
    13. Chong CW, Guo TF, Cheng L. Vapor pressure assisted interface delamination and failure of plastic IC packages - A micromechanics approach. Advances in Electronic Packaging 1 (InterPACK2003-35180), pp. 391-397 (2003).
    14. Chew HB, Guo TF, Cheng L. Computational study of compressive failure of metallic foam. 1st International Conference on Computational Methods (ICCM04), DEC 15-17, 2004. COMPUTATIONAL METHODS, PTS 1 AND 2: 563-568, 2006.
    15. Chew HB, Guo TF, Cheng L. Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005, art. no. 1614464, pp. 549-554.
    16. Chew HB, Guo TF, Cheng L. Void growth and damage ahead of a crack in pressure-sensitive dilatant polymers. High Performance Structure and Materials III. WIT Transactions on the Built Environment 85, pp.501-510, 2006.
    17. Tang S, Guo TF, Cheng L. Vapour pressure and void shape effects on void growth and rupture of polymeric solids. 35th solid mechanics conference, Krakow, September 4-8, 2006. pp. 257-258.
    18. Chew HB, Guo TF, Cheng L. Modeling adhesive failure in electronic packages. Proceedings of the Electronic Packaging Technology Conference, EPTC 2006, art. no. 4147341, pp. 787-792.
    19. Wong WH, Guo TF, Cheng L. Void growth under viscoelastic conditions in IC packages. Proceedings of the 4th International Conference on Materials and Advanced Technologies (ICMAT 2007), pp. 348-354. In: MEMS TECHNOLOGY and DEVICES (Eds.: A.Q. Liu, J.H. Wu, C. Lu and C.D. Reddy), Pan Stanford Publishing, 1-6 July 2007, Singapore.
    20. Wong WH, Guo TF, Cheng L. Influence of vapor pressure on rate-dependent void growth in IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC 2007, art. no. 4469724, pp. 664-669.
    21. Tang S, Guo TF, Cheng L. Rate dependent interface delamination in plastic IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC 2007, art. no. 4469807, pp. 680-685.

Book Chapter(s)

    1. Chew HB, Guo TF, Cheng L. Mechanism-based modeling of thermal and moisture induced failure of IC devices. In: Moisture Sensitivity of Plastic Packages of IC Devices. (Eds.) X.J. Fan; E. Suhir. Chapter 12, pp. 301-332. Springer, 2010. ISBN: 978-1-4419-5718-4

This page is last updated at: 24-APR-2013