Institute of High Performance Computing
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People
Electronics & Photonics (EP)
Dr. LIU Enxiao
 Title: Senior Scientist and Deputy Department Director
 Tel: 64191524
 Email: liuex@ihpc.astar.edu.sg
Research Interests:
 Microelectronic Interconnects & Packaging: Signal/Power integrity (SI/PI), IR drop Analysis, Electromagnetic Interference study,3D IC & TSV
 Electromagnetic Compatibility (EMC): Board & systemlevel EMC, Radiation analysis, Lightning protection simulation
 Computational Electromagnetics: FDTD, FDFD, IE (MoM); Application specific algorithms; Hybrid methods
 Multiphysics Modeling: Electricalthermal Modeling; Devicesystem modeling
Qualifications:

ACADEMIC QUALIFICATIONS
2001  2005 Ph.D. (Electrical & Computer Engineering), National University of Singapore
1992 –1999 M. Eng. (99), B. Eng. (96), Xi’an Jiaotong University, Xi’an, P. R. China
Professional Membership
2009 – now Senior Member, Institute of Electrical and Electronic Engineers (IEEE)
Honors and Awards
 Best Paper Award (first author), IEEE Electrical Design of Advanced Package & Systems Symposium, Dec. 2012
 BestPaperoftheYear Award (FY09) by A*STAR IHPC, 2010
 Best Industry Project (FY12), by A*STAR IHPC, 2013
 Best Industry Project (FY11), by A*STAR IHPC, 2012
 A*STAR Research Highlights: “Electronics: A faster model for speedier circuits,” March 2012
 A*STAR Research Highlights: “Device physics: Simulating electronic smog ,” July 2013
 Youth Innovation Award for Science and Technology (Second Prize, first recipient), Ministry of State Power, China, 2001 Public & Private (industry) Funding Projects Enxiao has performed in various capacities, such as principal / co(principal) investigator, project Leader, and team member, both for public and private funded projects (close to 5 millions in total as of 2013).
 “Conductive Composite Laminates,” 20122013, A*STAR Aerospace Program
 “Design Optimization of an Electromagnetic Nanopositioning Actuator,” 20122013, InterRI project
 “EPRC11: TSI (through silicon interposer) Project,” 2011 – 2013, Industry Project
 "Singapore 3D Throughsilicon Via (TSV) Consortium," 2009 –2013, A*STAR SERC PPP Funding
 “Simulator for Predicting Radiation – II”, 2012, Industry Project
 “Simulator for Predicting Radiation – I”, 2011, Industry Project
 “2D Field Solver for Signal Traces,” 2010, Industry Project
 EPRC9 consortium: “TSV Technology for Packaging of Cu Low k Chip,” 2007  2009, Industry project
 “Simulation for System Level Electronic Packaging (SSLEP),” 2006 – 2009, IHPC Grand Challenge Research Project (http://www.ihpc.astar.edu.sg/research_highlightsdetail.php?id=16)
 EMC Consortium: “Highspeed Electronics Design,” 2006, Industry project
 Highspeed Electronic Design, Training Course for a Company, 2006, Industry Training Project
Published Journals/ Articles:
Journals
Invited Talks
n "3D IC with TSV: design and modeling," Micron Technology, Inc. (Singapore), Jun. 2011
n "A Systematic SemiAnalytical Approach for Signal & Power Integrity Analysis of Electronic Packages with Multiple Vias," IEEE Electrical Design of advanced packaging and systems (EDAPS), Taipei, R. O. C, Dec. 2007
n "Noise and Radiation Control of High Speed IC and Packages," MicroSystems Packaging Initiative (MSPI) workshop for industries, IME, Singapore, 2006
[1] E.P. Li, X.C. Wei, E.X. Liu, Z. Z. Oo, and E. K. Chua, "Method and systems for modeling signal interaction in an electronic package," International Patent (WO 2009/108137) filed on 27 Feb 2009
[2] E.X. Liu, E. K. Chua, T. C. Chai, and Y. M. Khoo, "Array of throughsilicon vias (TSV) for improved power integrity of advanced packaging and methods of forming," Invention Disclosure (IDCEP0072009), Sept. 2009
Book Chapters
Two book chapters in a book titled: Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC, IEEE Press and John Wiley, New York, April 2012:
[1] EnXiao Liu, and ErPing Li, “Chapter 2: Macromodeling of Complex Interconnects in 3D integration”
[2] EnXiao Liu, “Chapter 6: Modeling of ThroughSilicon Vias in 3D Integration”
Journal Publication
[1] WeiJiang Zhao, BinFang Wang, EnXiao Liu, HarkByeong Park, Hyun Ho Park, Eakhwan Song, and ErPing Li, "An effective and efficient approach for radiated emission prediction based on amplitudeonly nearfield measurements," IEEE Trans. on EMC, vol. 54, no. 5, pp. 11861189, Oct. 2012.
[2] Z. Z. Oo, E.X. Liu, X.C. Wei, Y. Zhang, and E.P. Li, "Cascaded microwave network approach for power and signal integrity analysis of multilayer electronic packages," IEEE Trans. Compon. Packag. Technol. , vol. 1, no. 9, pp. 14281437, Sept. 2011.
[3] E.X. Liu, E.P. Li, W. B. Ewe, H. M. Lee, T. G. Lim, and S. Gao, " Compact Wideband Equivalent Circuit Model for electrical modeling of Throughsilicon via," IEEE Trans. Microwave Theory Tech., vol. 59, No. 6, pp. 14541460, Jun 2011.
[4] E.P. Li, X. Wei, A. C. Cangellaris, E.X. Liu, Y. Zhang, et al., "Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 248265, May 2010 (invited paper).
[5] Y. J. Zhang, Z. Z. Oo, X. C. Wei, E. X. Liu, J. Fan, and E. P. Li, "Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors," IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 401409, 2010.
[6] E.X. Liu, E.P. Li, Z. Z. Oo, X. Wei, Y. Zhang, and R. Vahldieck, "Novel Methods for Modeling of Multiple Vias in Multilayered ParallelPlate Structures," IEEE Trans. Microwave Theory Tech., vol. 57, no. 7, pp. 17241733, Jul. 2009.
[7] Z. Z. Oo, E. P. Li, X. C. Wei, E. X. Liu, Y. J. Zhang, and L.W. Li, "Hybridization of the Scattering Matrix Method and Modal Decomposition for Analysis of Signal Traces in a Power Distribution Network," IEEE Trans. Electromagn. Compat., vol. 51, no. 3, pp. 784791, Aug. 2009.
[8] Z. Z. Oo, E.X. Liu, E.P. Li, X. C. Wei, Y. Zhang, et al., "A semianalytical approach for systemlevel electrical modeling of electronic packages with large number of vias," IEEE Trans. Adv. Packag., vol. 31, no. 2, pp. 267274, May 2008.
[9] X. C. Wei, E.P. Li, E.X. Liu, and R. Vahldieck, "Efficient Simulation of Power Distribution Network by Using Integral Equation and Modal Decoupling Technology," IEEE Trans. Microwave Theory Tech., vol. 56, no. 10, pp. 22772285, Oct. 2008.
[10]X. C. Wei, E.P. Li, E.X. Liu, and X. Cui, "Efficient Modeling of Rerouted Return Currents in Multilayered PowerGround Planes by Using Integral Equation," IEEE Trans. Electromagn. Compat., vol. 50, no. 3, pp. 740743, Aug. 2008.
[11]X. C. Wei, E.P. Li, E.X. Liu, E. K. Chua, Z. Z. Oo, and R. Vahldieck, "Emission and Susceptibility Modeling of FiniteSize PowerGround Planes Using a Hybrid Integral Equation Method," IEEE Trans. Adv. Packag., vol. 31, no. 3, pp. 536543, Aug. 2008.
[12]E.X. Liu, E.P. Li, and L.W. Li, "Analysis of multilayer planar circuits by a hybrid method," IEEE Microwave Wireless Components Lett., vol. 16, no. 2, pp. 6668, Feb. 2006.
[13]E.X. Liu, E.P. Li, and L.W. Li, "Hybrid FDTDMPIE method for the simulation of locally inhomogeneous multilayer LTCC structure," IEEE Microwave Wireless Components Lett., vol. 15, no. 1, pp. 4244, Jan. 2005.
[14]E.X. Liu, E.P. Li, L.W. Li, and Z. Shen, "Finitedifference timedomain macromodel for simulation of electromagnetic interference at highspeed interconnects," IEEE Trans. Magn., vol. 41, no. 1, pp. 6571, Jan. 2005.
[15]E.P. Li, E.X. Liu, L.W. Li, and M.S. Leong, "A coupled efficient and systematic fullwave timedomain macromodeling and circuit Simulation method for signal integrity analysis of highspeed interconnects," IEEE Trans. Adv. Packag., vol. 27, no. 1, pp. 213223, Feb. 2004.
[16]E.X. Liu, E.P. Li, and L.W. Li, "Analysis of signal propagation on highspeed planar interconnect systems based on fullwave and macromodeling technique," Microwave Opt. Technol. Lett., vol. 39, no., pp. 183187, Nov. 2003.
Conferences
Conference Papers:
[1] E.X. Liu and E.P. Li, "Fast voltage drop modeling of power grid with application to silicon interposer analysis," in IEEE 63rd Electronic Components and Technology Conference (ECTC), LV:Nevada, 2831 May 2013, pp. 11091114.
[2] W.J. Zhao, H. B. Park, M. Tan, H. H. Park, E.X. Liu, E. Song, and E.P. Li, "Farfield prediction from amplitudeonly nearfield measurements using equivalent electric currents," in IEEE International Symposium on Electromagnetic Compatibility (EMC), Pittsburgh, PA, Aug. 2012, pp. 590593.
[3] X. C. Wei, Z. Z. Oo, E.X. Liu, and E.P. Li, "Power integrity analysis of TSV based 3D integrated circuits," in International Conference on Microwave and Millimeter Wave Technology, Shenzhen, China, May 2012, pp. 14.
[4] Z. Z. Oo, E.X. Liu, J. R. Cubillo, and E.P. Li, "Systematic analysis for static and dynamic drops in power supply grids of 3D integrated circuits," in AsiaPacific Symposium on Electromagnetic Compatibility, Singapore, May 2012, pp. 4952.
[5] E.X. Liu, J. R. Cubillo, E.P. Li, H. Zhao, Z. Z. Oo, and H. M. Lee, "Effective resistance approach for DC analysis of power grid on throughsilicon interposer (TSI)," in IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Taiwan, 911 Dec. 2012, pp. 14.
[6] E.P. Li and E.X. Liu, "Domain and modal decomposition for efficient signal and power integrity analysis of multilayer packages and PCBs," in IEEE MTTS International Microwave Symposium, Montreal, Canada, June 2012, pp. 13.
[7] H. M. Lee, E.X. Liu, G. S. Samudra, and E.P. Li, "Impact of TSV induced thermomechanical stress on semiconductor device performance," in IEEE Electrical Design of Advanced Packaging and Systems Symposium, Hangzhou, China, 911 Dec. 2012, pp. 189192.
[8] J. R. Cubillo, R. Weerasekera, Z. Z. Oo, E.X. Liu, B. Conn, S. Bhattacharya, and R. Patti, "Interconnect design and analysis for Through Silicon Interposers (TSIs)," in 3D Systems Integration Conference (3DIC), 2011 IEEE International, Osaka, Japan, Jan. 2012 2012, pp. 16.
[9] Z. Z. Oo, E.X. Liu, X. C. Wei, E.P. Li, and Y. Zhang, "Equivalent circuit model for modeling viastripline transition in a multilayered electronic packages," in Proc. APEMC 2011, South Korea, May 2011
[10] Z. Z. Oo, E.X. Liu, and E.P. Li, "New circuit model for modeling differential pair of throughhole vias in multilayered electronic packages," in IEEE 13th Electronics Packaging Technology Conference, Singapore, Dec. 2011, pp. 163166.
[11] E.X. Liu and E.P. Li, "Electrical performance of vertical natural capacitor for RF systemonchip in 32nm technology," in IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, San Jose, CA, Oct. 2011, pp. 3538.
[12] E.X. Liu, H. M. Lee, X.C. Wei, and E.P. Li, "Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix," in IEEE Electrical Design of Advanced Packaging and Systems Symposium, Hangzhou, China, Dec. 2011, pp. 14.
[13] H. M. Lee, E.X. Liu, E.P. Li, and J. Fuhrmann, "Impact of technology scaling on electrical characteristics of throughsilicon via correlated with equivalent circuits," in EMC Europe, York, UK, Sept. 2011, pp. 339344.
[14] X.C. Wei, E.P. Li, and E.X. Liu, "Efficient Signal and Power Integrity Analysis by Using Modal Decomposition and Integral Equations," in Proc. IEEE Int. Symp. Electromagn. Compat., Fort Lauderdale, FL, Jul. 2010, pp. 384389.
[15] Z. Z. Oo, E.X. Liu, and X.C. Wei, "Accurate equivalent circuit model for viastripline connection in multilayer electronic packages," in Proc. IEEE EDAPS, Singapore, Dec. 2010
[16] E.X. Liu, E.P. Li, W.B. Ewe, and H. M. Lee, "Multiphysics modeling of throughsilicon vias with equivalent circuit approach," in Proc. IEEE EPEPS, Austin, Texas, Oct. 2010, pp. 3336.
[17] E.P. Li and E.X. Liu, "Signal integrity analysis of throughsilicon via based 3D integrated circuit," in Proc. International Symposium on Signals Systems and Electronics (ISSSE), Nanjing, China, Sept. 2010, pp. 14.
[18] Y. Zhang, E.P. Li, Z. Z. Oo, W. Zhang, E.X. Liu, X. Wei, and J. Fan, "Analytical formulas for barrelplate and padplate capacitance in the physicsbased via circuit model for signal integrity analysis of PCBs," in Proc. Asia Pacific Microwave Conference (APMC 2009), Singapore, Dec. 2009, pp. 24322435.
[19] Z. Z. Oo, E.X. Liu, X. Wei, Y. Zhang, and E.P. Li, "Analysis of SMT decoupling capacitor placement in electronic packages using hybrid modeling method," in Proc. 12th International Symposium on Integrated Circuits (ISIC09), Singpaore, Dec. 2009, pp. 627630.
[20] E.X. Liu, X. Wei, Z. Z. OO, Y.J. Zhang, W. Zhang, and E.P. Li, "Method for SystemLevel Signal and Power Integrity Modeling of HighSpeed Electronic Packages," in Proc. 11th Electron. Packag. Technol. Conf. , Singapore, Dec. 2009, pp. 96101.
[21] Y. M. Khoo, E. K. Chua, T. G. Lim, and E.X. Liu, "High frequency characterization of through silicon via structure," in Proc. 11th Electron. Packag. Technol. Conf. , Singapore, Dec. 2009, pp. 536540.
[22] X. C. Wei, E. P. Li, and E. X. Liu, "An Efficient Equivalent Circuit Model for the EMC Analysis of Power/Ground Noise," in Proc. 12th IEEE Workshop Signal Propag. Interconnects, France, May 2008, pp. 14.
[23] Z. Z. Oo, X. C. Wei, E.X. Liu, E.P. Li, and L.W. Li, "Efficient analysis for multilayer powerground planes with multiple vias and signal traces in an advanced electronic package," in Proc. IEEE Conf. Elect. Performance Electron. Packag., San Jose: CA, 2008, pp. 9598.
[24] M. I. Montrose and E. X. Liu, "Radiated emission effects from multiple via stimulation within a printed circuit board," in Proc. 19th Int. Zurich Symp. Electromagn. Compat. (APEMC 2008), 2008, pp. 176179.
[25] E.X. Liu, X. Wei, Z. Z. Oo, and E.P. Li, "A 2D Time Domain Method for Electrical Analysis of Electronic Packages," in Proc. 10th Electron. Packag. Technol. Conf. , Singapore, Dec. 2008, pp. 254259.
[26] E.X. Liu, X. Wei, Z. Z. Oo, and E.P. Li, "An efficient method for power integrity and EMI Analysis of advanced packages," in Proc. 58th Electron. Comp. Technol. Conf. , Orlando: FL, 2008, pp. 652657.
[27] E.X. Liu, E.P. Li, and X. Wei, "Thermalaware electrical analysis of highspeed interconnect," in Proc. IEEE EDAPS, Seoul: Korea, Dec. 2008, pp. 171174.
[28] E.P. Li, X. C. Wei, E.X. Liu, and Z. Z. Oo, "Advanced parallel algorithm for systemlevel EMC modeling of highspeed electronic package," in Proc. IEEE Int. Symp. Electromagn. Compat., Detroit: MI, Aug. 2008, pp. 15.
[29] X. C. Wei, E. X. Liu, Z. Z. Oo, E. P. Li, and R. Vahldieck, "A Novel Approach for System Level Package Modeling to Address Signal and Power Integrity Issues," in Proc. 57th Electron. Comp. Technol. Conf. , Reno, NV, 2007, pp. 16531658.
[30] Z. Z. Oo, E.X. Liu, X. Wei, M. T. Y. Choon, E.P. Li, Y. Zhang, and L.W. Li, "Hybrid of Scattering Matrix Method and Integral Equation used for Cosimulation of Power Integrity and EMI in Electronic Package with Large Number of P/G Vias," in Proc. 57th Electron. Comp. Technol. Conf. , Reno, NV, 2007, pp. 815820.
[31] Z. Z. Oo, E.X. Liu, W. X. Chang, E.P. Li, C. E. Kee, and L.W. Li, "Novel CoSimulation Method for Analysis of Power Integrity and EMI in Electronic Packages with Large Number of Power/ground Vias," in Proc. 9th Electron. Packag. Technol. Conf., 2007, pp. 421424.
[32] M. I. Montrose and E.X. Liu, "Power and Ground Bounce Effects on Component Performance Based on Printed Circuit Board Edge Termination Methodologies," in Proc. IEEE Int. Symp. Electromagn. Compat., 2007, pp. 16.
[33] E.X. Liu, X. C. Wei, Z. Z. Oo, and E.P. Li, "Modeling of advanced multilayered packages with multiple vias and finite ground planes," in Proc. IEEE 16th Conf. Elect. Performance Electron. Packag., Atlanta, Georgia, Oct. 2007, pp. pp. 275278.
[34] E.X. Liu, X. C. Wei, Z. Z. Oo, and E.P. Li, "An Efficient Method for Power integrity and EMI Analysis of IrregularShaped Power Ground Planes in Packages," in Proc. IEEE 16th Conf. Elect. Performance Electron. Packag., Atlanta: Georgia, Oct. 2007, pp. 263266.
[35] E.P. Li, E.X. Liu, Z. Z. Oo, X. Wei, Y. J. Zhang, and R. Vahldieck, "A Systematic SemiNumerical Approach for Modeling of Signal and Power Integrity of Electronic Packages," in Proc. IEEE Int. Symp. Electromagn. Compat., 2007, pp. 16.
[36] M. I. Montrose and E.X. Liu, "Radiated Emission Analysis from Printed Circuit Board Edges Using Multiple Stimulus Sources," in Proc. 17th Int. Zurich Symp. Electromagn. Compat., Singapore, Mar. 2006, pp. 574577.
[37] E.X. Liu, Z. Z. Oo, and E.P. Li, "Analysis of Rectangular PowerGround Plane Pairs for Noise Suppression," in Proc. 1st Electron. System Integration Technol. Conf., Dresden, Germany, Sept. 2006, pp. 241246.
[38] E.X. Liu, E.P. Li, and L.W. Li, "Extraction of Circuit Parameters for Transmission Lines by Compact 2D FDFD Method," in Proc. 17th Int. Zurich Symp. Electromagn. Compat., Singapore, Mar. 2006, pp. 188191.
[39] E.X. Liu and E.P. Li, "Comparison of two compact 2DFDFD methods and their application to extraction of circuit parameters," in Proc. IEEE Int. Symp. Electromagn. Compat., Portland, USA, Aug. 2006, pp. 702706.
[40] H.S. Chu, E.P. Li, E.X. Liu, and J. L. Dubard, "Coupled computational intelligence and timedomain method for design of the microwave devices," in Proc. AsiaPacific Microwave Conference, Japan, Dec. 2006, pp. 19301933.
[41] Z.H. Liu, E.P. Li, K. Y. See, and E.X. Liu, "Study on power bus noise isolation using SPICE compatible method," in Proc. IEEE Int. Symp. Electromagn. Compat., Chicago, IL, 2005, pp. 438441.
[42] H.F. Jin, E.P. Li, and E.X. Liu, "A novel integrated approach for simulation of electromagnetic susceptibility problem," in Proc. IEEE Int. Symp. Electromagn. Compat., Chicago, IL, 2005, pp. 446450.
[43] Z. Z. Oo, E.X. Liu, E.P. Li, Y. J. Zhang, and L.W. Li, "Computing the RCS of Dielectric Coated Objects using Multilevel Fast Multipole Algorithm," in Proc. 3rd Int. Conf. Comput. Electromagn. Appl., Beijing, Nov. 2004, pp. 100103.
[44] M. I. Montrose, E.X. Liu, and L. ErPing, "Analysis on the effectiveness of printed circuit board edge termination using discrete components instead of implementing the 20H rule," in Proc. IEEE Int. Symp. Electromagn. Compat., Santa Clara, CA, 2004, pp. 4550.
[45] E.X. Liu, E.P. Li, and L.W. Li, "Simulation of Locally Inhomogeneous Multilayer Planar Structure by Hybrid Method," in Proc. 3rd Int. Conf. Comput. Electromagn. Appl., Beijing, Nov. 2004, pp. 122125.
[46] E.X. Liu, E.P. Li, and L.W. Li, "Electrical performance simulation of inhomogeneous multilayer LTCC structure by hybrid method," in Proc. 6th Electron. Packag. Technol. Conf., Singapore, Dec. 2004, pp. 657660.
[47] E.X. Liu, E.P. Li, and L.W. Li, "Hybrid FDTDMPIE method for the simulation of locally inhomogeneous multilayer LTCC structure," in Proc. 5th Electron. Packag. Technol. Conf., Singapore, Dec. 2003, pp. 160163.
[48] E.P. Li, E.X. Liu, Z. Shen, and L.W. Li, "FDTDmacromodeling technique for simulation of electromagnetic interference at highspeed interconnects," in Proc. 14th Conf. Computation Electromagn. Fields, Saratoga Springs, NY, Jul. 2003, pp. 156157.
[49] E.X. Liu, E.P. Li, X. Ying, L.W. Li, and K. H. Lee, "Transient simulation of highspeed interconnects using coupled model order reduction and FDTDmacromodeling technique," in Proc. Int. Conf. Science and Engineering Computation (ICSEC 2002), Singapore, 2002, pp. 283286.
Other(s)
Professional Services
Services to Societies
2009, 2012  2013 Chair, IEEE Singapore EMC Chapter
2007 – 2008, 20102011 Executive Committee Member, IEEE Singapore EMC Chapter
Conference Committees
# International Advisory Committee (IAC)
l IAC member, GlobeSpace 2014  EMC and Product Safety, Israel, 2014
l IAC member, IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Japan, Dec. 2013
# Technical Program Committee (TPC)
l Technical Chair, Asia Pacific Symposium on EMC, 2124 May 2012, Singapore.
l IEEE Electronics Packaging Technology Conference (EPTC), Singapore
1) TPC member, 2011/2012/2013; 2) Technical Subcommittee CoChair, 12th EPTC, 2010; 3) TPC Subcommittee Chair, 11th EPTC, 2009; 3) TPC Subcommittee coChair & Session Chair, 10th EPTC, 2008.
l TPC member & Session Chair, 9th Electronics Packaging Technology Conference (ETPC), Dec. 2007, Singapore.
l TPC member, IEEE Electronic Component and Technology Conference (ECTC)
1) 66th ECTC (Las Vegas, NV: USA, May 2013); 2) 67th ECTC (USA, May 2014)
l TPC member, IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS):
1) EDAPS 2013, Taipei; 2) EDAPS 2012 Hangzhou; 3) EDAPS 2011, Singapore
l TPC member, IEEE MTTS International Wireless Symposium (IWS 2013), Beijing, China
l TPC member, Asia and South Pacific Design Automation Conference
1) 15th ASPDAC, Taipei. Jan. 2010; 2) 14th ASPDAC, Yokohama, Japan, Jan., 2009.
l Technical Track Chair, IEEE TENCON conference( an international technical conference of IEEE Region 10), Singapore
# Organizing Committee (OC)
l Organizing Chair, IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), Singapore, 0709 Dec., 2010
l Session Chair, IEEE conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, USA, 2326 October, 2011.
l Session Chair and Workshop Organizer, Asia Pacific Symposium on EMC, Korea, 1619 May 2011.
l OC member, IEEE Electronics Packaging Technology Conference (EPTC), Singapore, 2011. & 2012.
l OC Member,ï¿½ AsiaPacific Microwave Conference (APMC 2009), Singapore, 710 Dec., 2009.
l Chair for Special Sessions, 19th International EMC Zurich Symposium & 2008 Asia Pacific Symposium on EMC, 912 May 2008, Singapore.
l OC member, 17th International Zurich Symposium on EMC, 26 Feb.  3 Mar. 2006, Singapore.
Journal Paper Reviewer
IEEE Transactions on Microwave Theory and Techniques
IEEE Transactions on Components, Packaging and Manufacturing Technologies
IEEE Transactions on Electromagnetic Compatibility
IEEE Transactions on Electron Devices
IEEE Transactions on Antennas and Propagation
IEEE Microwave and Wireless Components Letter
Progress In Electromagnetics Research (PIER)
EUROSIM Simulation Modeling Practice and Theory
International Journal of Numerical Modeling
Conference Paper Reviewer
Reviewer for more than 10 international conferences including EMC Zurich 2006, EPTC 2007  2013, APEMC 2008/2010/2012/2013, IEEE TENCON 2009, APMC 2009, ISIC 2009, ASPDAC 2009/2010, ISAP 2010 & 2011, EDAPS 2010 & 2011, IEEE ECTC 2013.
This page is last updated at: 24JAN2014