Institute of High Performance Computing

• Directors
• Computing Science (CS)
• Electronics & Photonics (EP)
• Engineering Mechanics (EM)
• Fluid Dynamics (FD)
• Material Science & Engineering (MSE)
• IHPC Independent Investigatorship (I³)

Engineering Mechanics (EM)

Dr. WONG Wei Hin Mark

• Title: Scientist
• Tel: 64191342
• Email: wongwhm@ihpc.a-star.edu.sg

Research Interests:

• Soft materials
• Materials modeling
• Fracture mechanics
• Computational Welding Mechanics

Qualifications:

• Ph.D (NUS)
• M.Eng (NUS)
• B.Eng (NUS)

Published Journals/ Articles:

Journals

1. Wong, W.H., Guo, T.F., Cheng, L., 2010. Void growth and interaction in a soft material. Int J Mod Phy B 24 (1-2), 295-304.
2. Wong, W.H., Guo, T.F., Zhang, Y.W., Cheng, L.,, 2010. Humidity-driven bifurcation in a hydrogel-actuated nanostructure: A three-dimensional computational analysis. Int J Solids Struct 47 (16), 2034-2042.
3. Wong, W.H., Guo, T.F., Zhang, Y.W., Cheng, L., 2010. Surface instability maps for soft materials. Soft Matter, DOI: 10.1039/c0sm00351d.
4. Wong, W.H., Guo, T.F., Zhang, Y.W., Cheng, L., 2010. Chemo-mechanically driven void growth and instability in hydrogels. Manuscript submitted.

Conferences

1. Wong, W.H., Guo, T.F., Cheng, L., 2007. Void growth under viscoelastic conditions in IC packages. Proceedings of the 4th International Conference on Materials and Advanced Technologies (ICMAT 2007), pp. 348-354. In: MEMS TECHNOLOGY and DEVICES (Eds.: A.Q. Liu, J.H. Wu, C. Lu and C.D. Reddy), Pan Stanford Publishing, Singapore.
2. Wong, W.H., Guo, T.F., Cheng, L., 2007. Influence of vapor pressure on rate-dependent void growth in IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC 2007, art. no. 4469724, pp. 664-669.