Institute of High Performance Computing

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People: Vibrant & Dynamic Culture

People

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Electronics & Photonics (EP)

Dr. ZAW Zaw Oo

Dr. ZAW Zaw Oo


Research Interests:

  • Computational Electromagnetics
  • Modeling and Simulation for Electromagnetic and Electronic Systems
  • Development of Advanced Algorithms for System-level Eletronic Package Simulation
  • Fast Algorithms for Large-scale EM Scattering / Radiation Problems (Antenna Systems)

Qualifications:

  • Ph.D. in Electrical and Computer Engineering, National University of Singapore, Singapore, 2009.
  • M.Eng. in Electrical and Computer Engineering, National University of Singapore, Singapore, 2003.
  • B.Eng. in Electronics, Yangon Technological University, Myanmar, 1998.

Published Journals/ Articles:

Journals

    • Zaw Zaw Oo, En-Xiao Liu, Xingchang Wei, Yaojiang Zhang, and Er-Ping Li, "Cascaded microwave network approach for power and signal integrity analysis of multilayer electronic packages," IEEE Trans. on Components, Packaging and Manufacturing Technology, vol. 1, no. 9, pp. 1428 - 1437, September 2011.
    • Yaojiang Zhang, Zaw Zaw Oo, Xingchang Wei, En-Xiao Liu, Jun Fan, and Er-Ping Li, "Systematic microwave network analysis for multilayer printed circuit boards with vias and decoupling capacitors," IEEE Trans. on Electromagnetic Compatibility, vol. 52, no. 2, pp. 401 - 409, May 2010.
    • Zaw Zaw Oo, Er-Ping Li, Xingchang Wei, En-Xiao Liu, Yaojiang Zhang, and Le- Wei Joshua Li, "Hybridization of the scattering matrix method and modal decomposition for analysis of signal traces in a power distribution network," IEEE Trans. on Electromagnetic Compatibility, vol. 51, no. 3, pp. 784 - 791, August 2009.
    • En-Xiao Liu, Er-Ping Li, Zaw Zaw Oo, Xingchang Wei, and Rudigerand Vahldieck, "Novel methods for modeling of multiple vias in multilayered parallel-plate structures," IEEE Trans. on Microwave Theory & Techniques, vol. 57, no. 7, pp. 1724-1733, July 2009.
    • Xingchang Wei, Er-Ping Li, En-Xiao Liu, Eng-Kee Chua, Zaw Zaw Oo, and Rudigerand Vahldieck, "Emission and susceptibility modeling of finite-size power-ground planes using a hybrid integral equation method," IEEE Trans. on Advanced Packaging, vol. 31, no. 3, pp. 536-543, August 2008.
    • Zaw Zaw Oo, En-Xiao Liu, Er-Ping Li, Xingchang Wei, Yao-Jiang Zhang, Mark Tan, Le-Wei Joshua Li, and Rudigerand Vahldieck, "A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias," IEEE Trans. on Advanced Packaging, vol. 31, no. 2, pp. 267-274, May 2008.
    • Zaw Zaw Oo, Li Er-Ping, and Li Le-Wei, “Analysis and design on aperture antenna systems with large electrical size using multilevel fast multipole method”, Journal Electromagnetic Waves and Applications, vol. 19, no. 11, pp. 1485-1500, 2005.

Conferences

    • Zaw Zaw Oo, En-Xiao Liu, J. R. Cubillo,†and†Er-Ping Li, "Systematic analysis for static and dynamic drops in power supply grids of 3-D integrated circuits," in Proc. Asia Pacific EMC Symposium 2012, May 2012.
    • Zaw Zaw Oo, En-Xiao Liu,†and Er-Ping Li,†"New circuit model for modeling differential pair of through-hole vias in†multilayered electronic packages," in Proc. 13th Electronics Packaging Technology Conference, Dec 2011.
    • Zaw Zaw Oo, En-Xiao Liu, Xingchang Wei, Er-Ping Li, and Yaojiang Zhang, "Equivalent circuit model for modeling via-stripline transition in multilayered electronic packages," in Proc. Asia Pacific EMC Symposium 2011, May 2011.
    • Zaw Zaw Oo and Er-Ping Li, "Quantifying decoupling capacitor placement for enhancement of power and signal integrity in electronic packages and ICs," in Proc. 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits, November 2009.
    • Yaojiang Zhang, Er-Ping Li, Zaw Zaw Oo, Wenzu Zhang, En-Xiao Liu, Xingchang Wei, and Jun Fan, "Analytical formulas for the barrel-plate and pad-plate capacitance in the physic-based via circuit model for signal integrity analysis of PCBs," in Proc. Asia-Pacific Microwave Conference 2009, December 2009.
    • Zaw Zaw Oo, En-Xiao Liu, Xingchang Wei, Yaojiang Zhang, and Er-Ping Li, "Analysis of SMT decoupling capacitor placement in electronic packages using hybrid modelling method," in Proc. IEEE 12th International Symposium on Integrated Circuits, December 2009.
    • Zaw Zaw Oo, Xingchang Wei, En-Xiao Liu, Er-Ping Li, and Le-Wei Li, "Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package," in Proc. IEEE 17th Conference on Electrical Performance of Electronic Packaging, October 2008, pp. 95-98.
    • En-Xiao Liu, Xingchang Wei, Zaw Zaw Oo, and Er-Ping Li, “An efficient method for Power integrity and EMI Analysis of advanced packages,” in Proc. 58th Electronic Components and Technology Conference, May 2008, pp. 652-657.
    • Zaw Zaw Oo, En-Xiao Liu, Xingchang Wei, and Er-Ping Li, “An efficient algorithm for analysis of power integrity in electronic packages,” in Proc. 2008 Asia-Pacific Sympsoium on Electromagnetic Compatibility & 19th International Zurich Symposium on Electromagnetic Compatibility, May 2008, pp. 938-941.
    • Zaw Zaw Oo, En-Xiao Liu, Xingchang Wei, Er-Ping Li, Eng-Kee Chua, and Le-Wei Li, “Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias,” in Proc. 2007 9th Electronics Packaging Technolgy Conference, December 2007, pp. 421-424.
    • En-Xiao Liu, Xingchang Wei, Zaw Zaw Oo, and Er-Ping Li, “An efficient method for Power integrity and EMI analysis of irregular-shaped power/ground planes in packages,” in Proc. IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, October 2007, pp. 263 - 266.
    • En-Xiao Liu, Xingchang Wei, Zaw Zaw Oo, Er-Ping Li, and Li Le-Wei, “Modeling of advanced multilayered packages with multiple vias and finite ground planes,” in Proc. IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, October 2007, pp. 275-278.
    • Er-Ping Li, En-Xiao Liu, Zaw Zaw Oo, Xingchang Wei, and Yaojiang Zhang, “A systematic semi-numerical approach for modeling of signal and power integrity of electronic packages,” in Proc. 2007 IEEE International Symposium on Electromagnetic Compatibility, July 2007, pp. 2047-2052.
    • Zaw Zaw Oo, En-Xiao Liu, Xingchang Wei, Mark Tan Yew Choon, Er-Ping Li, Yaojiang Zhang, and Le-Wei Li, “Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias,” in Proc. 57th Electronic Components and Technology Conference, May 2007, pp. 815-820.
    • Xingchang Wei, En-Xiao Liu, Zaw Zaw Oo, Er-Ping Li, and Rudigerand Vahldieck, “A novel approach for system level package modeling to address Signal and Power integrity issues,” in Proc. 57th Electronic Components and Technology Conference, May 2007, pp. 1653-1658.
    • En-Xiao Liu, Zaw Zaw Oo, and Er-Ping Li, “Analysis of rectangular power-ground plane pairs for noise suppression,” in Proc. 2006 1st Electronics Systemintegration Technology Conference, September 2006, pp. 241-246.
    • Zaw Zaw Oo and Le-Wei Li, “Different excitation feed models for full-wave simulation of aperture antenna systems,” in Proc. 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, pp. 205-208.
    • Zaw Zaw Oo, En-Xiao Liu, Er-Ping Li, Yaojiang Zhang, and Le-Wei Li, “Computing the RCS of dielectric coated objects using multilevel fast multipole algorithm: Impedance boundary condition approach,” in Proc. 3rd International Conference on Computational Electromagnetics and Its Applications, 2004, pp. 100-103.
    • Zaw Zaw Oo, Le-Wei Li, Jian-Ying Li, and Er-Ping Li, "Analysis and design of reflector and horn antennas using multilevel fast multipole algorithm (MLFMA)", in Proc. 2003 IEEE AP-S and URSI International Symposium, June 2003, Columbus, Ohio, USA.
    • Zaw Zaw Oo, Le-Wei Li, Jian-Ying Li, and Pang-Shyan Kooi, "Computation of radar cross sections using multilevel fast multipole algorithm", in Proc. 3rd International Conference on Microwave and Millimeter Wave Technology, August 2002, Beijing, China.

Book Chapter(s)

    • Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC -†Chapter 3, IEEE Press, John Wiley & Sons, Inc., New Jersey, April 2012.

This page is last updated at: 02-JUL-2013